CP704V Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistors PNP - High Voltage Transistor Chip

PROCESS CP704V
Small Signal Transistors
PNP - High Current Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
22 x 22 MILS
7.1 MILS
3.7 x 3.7 MILS
4.2 x 4.2 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 5 INCH WAFER
35,100
PRINCIPAL DEVICE TYPES
MPSA55
MPSA56
w w w. c e n t r a l s e m i . c o m
R1 (22-March 2010)