CP667 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP- Saturated Switch Transistor Chip

PROCESS CP667
Small Signal Transistor
PNP- Saturated Switch Transistor Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
31 x 31 MILS
9.0 MILS
5.9 x 11.8 MILS
6.5 x 13.8 MILS
Al - 30,000Å
Au - 15,000Å
GROSS DIE PER 4 INCH WAFER
11,300
PRINCIPAL DEVICE TYPES
2N3467
2N3468
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R1 (1-August 2002)