CP618 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP - Silicon RF Transistor Chip

PROCESS CP618
Small Signal Transistor
PNP - Silicon RF Transistor Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
21.7 x 21.7 MILS
9.0 MILS
3.5 MILS DIAMETER
3.5 x 3.5 MILS
Al - 30,000Å
Au - 10,000Å
GROSS DIE PER 4 INCH WAFER
23,990
PRINCIPAL DEVICE TYPES
CM5583
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R2 (1-August 2002)