CP595 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP - High Voltage Transistor Chip

PROCESS CP595
Small Signal Transistor
PNP - High Voltage Transistor Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
30 x 30 MILS
7.0 MILS
8.0 x 8.0 MILS
7.6 x 7.6 MILS
Al - 30,000Å
Au - 10,000Å
GROSS DIE PER 4 INCH WAFER
12,550
PRINCIPAL DEVICE TYPES
2N5680
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R2 (1-August 2002)