CP593_10 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP - Amp/Switch Transistor Chip

PROCESS CP593
Small Signal Transistor
PNP - Amp/Switch Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
19 x 19 MILS
9.0 MILS
3.5 x 4.3 MILS
3.5 x 4.5 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 4 INCH WAFER
30,475
PRINCIPAL DEVICE TYPES
2N4403
2N5366
w w w. c e n t r a l s e m i . c o m
R2 (22-March 2010)