CP593 Datasheet, PDF (1/1 Pages) Central Semiconductor Corp – Small Signal Transistors PNP - Amp/Switch Transistor Chip

PROCESS CP593
Small Signal Transistors
PNP - Amp/Switch Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
Epitaxial Planar
19 x 19 MILS
9.0 MILS
3.5 x 4.3 MILS
3.5 x 4.5 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 4 INCH WAFER
30,475
PRINCIPAL DEVICE TYPES
2N4403
2N5366
145 Adams Avenue
Hauppauge, NY 11788 USA
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R0 (5- January 2006)