CP592 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP - Amp/Switch Transistor Chip

PROCESS CP592
Small Signal Transistor
PNP - Amp/Switch Transistor Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
EPITAXIAL PLANAR
12 x 20 MILS
9.0 MILS
3.6 X 3.6 MILS
3.6 X 3.6 MILS
Al - 30,000Å
Au - 18,000Å
GEOMETRY
BACKSIDE COLLECTOR
GROSS DIE PER 4 INCH WAFER
47,150
PRINCIPAL DEVICE TYPES
2N3906
CMPT3906
CMST3906
CXT3906
CZT3906
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R2 (1-August 2002)