CP591X Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP - Amp/Switch Transistor Chip

PROCESS CP591X
Small Signal Transistor
PNP - Amp/Switch Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
EPITAXIAL PLANAR
19 x 19 MILS
5.9 MILS
3.5 x 4.3 MILS
3.5 x 4.5 MILS
Al - 13,000Å
Au - 18,000Å
GEOMETRY
BACKSIDE COLLECTOR R1
GROSS DIE PER 5 INCH WAFER
45,900
PRINCIPAL DEVICE TYPES
2N2905A
2N2907A
CMPT2907A
CMST2907A
CXT2907A
CZT2907A
PN2907A
w w w. c e n t r a l s e m i . c o m
R2 (10-February 2011)