CP591V Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP - Amp/Switch Transistor Chip

PROCESS CP591V
Small Signal Transistor
PNP - Amp/Switch Transistor Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
EPITAXIAL PLANAR
19 x 19 MILS
7.1 MILS
3.5 x 4.3 MILS
3.5 x 4.5 MILS
Al - 30,000Å
Au - 18,000Å
GEOMETRY
GROSS DIE PER 4 INCH WAFER
30,600
BACKSIDE COLLECTOR R1
PRINCIPAL DEVICE TYPES
2N2905A
2N2907A
CMPT2907A
CMST2907A
CXT2907A
CZT2907A
PN2907A
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R0 (31-May 2006)