CP589 Datasheet, PDF (1/1 Pages) Central Semiconductor Corp – Power Transistors PNP - Amp/Switch Transistor Chip

Central^TM
Semiconductor Corp.
PROCESS CP589
Power Transistors
PNP - Amp/Switch Transistor Chip
PROCESS DETAILS
PROCESS
DIE SIZE
DIE THICKNESS
BASE BONDING PAD AREA
EMITTER BONDING PAD AREA
TOP SIDE METALIZATION
BACK SIDE METALIZATION
EPITAXIAL BASE
80 x 80 MILS
12 MILS
12 x 18 MILS
13 x 28 MILS
Al - 30,000Å
Cr/Ni/Ag - Ni-6,000Å; Ag-10,000Å
GEOMETRY
B
E
PRINCIPAL DEVICE TYPES
CJD42C
TIP42C
BACKSIDE COLLECTOR
Please refer to
selection guide on page 20.
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