CP588_06 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP - Low Noise Amplifier Transistor Chip

PROCESS CP588
Small Signal Transistor
PNP - Low Noise Amplifier Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
15 x 15 MILS
9.0 MILS
4.0 x 4.0 MILS
5.5 x 5.5 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 4 INCH WAFER
53,730
PRINCIPAL DEVICE TYPES
2N2605
2N3799
PN4250A
CMPT5086
CMPT5087
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R3 (21-August 2006)