CP588V Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP - Low Noise Amplifier Transistor Chip

PROCESS CP588V
Small Signal Transistor
PNP - Low Noise Amplifier Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
14.6 x 14.6 MILS
7.1 MILS
3.9 x 3.9 MILS
5.5 x 5.5 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 4 INCH WAFER
54,599
PRINCIPAL DEVICE TYPES
2N2605
2N3799
PN4250A
CMPT5086
CMPT5087
BACKSIDE COLLECTOR
w w w. c e n t r a l s e m i . c o m
R2 (22-March 2010)