CP566 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP - Silicon Chopper Transistor Chip

PROCESS CP566
Small Signal Transistor
PNP - Silicon Chopper Transistor Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
31.5 x 31.5 MILS
11 MILS
7.8 x 6.2 MILS
8.0 x 5.3 MILS
Al - 12,000Å
Au - 10,000Å
GROSS DIE PER 4 INCH WAFER
11,380
PRINCIPAL DEVICE TYPES
CMPT404A
MPS404A
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R2 (1-August 2002)