CP555 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP - Saturated Switch Transistor Chip

PROCESS CP555
Small Signal Transistor
PNP - Saturated Switch Transistor Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
BACKSIDE COLLECTOR
EPITAXIAL PLANAR
15 X 10 MILS
8 MILS
3.6 X 2.4 MILS
3.6 X 2.4 MILS
Al - 20,000Å
Au - 15,000Å
GROSS DIE PER 4 INCH WAFER
75,330
PRINCIPAL DEVICE TYPES
CMPT3640
CMPT4209
2N4209
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R2 (1-August 2002)