CP394R Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal MOSFET Transistor N-Channel Enhancement-Mode Transistor Chip

PROCESS CP394R
Small Signal MOSFET Transistor
N-Channel Enhancement-Mode Transistor Chip
PROCESS DETAILS
Die Size
Die Thickness
Gate Bonding Pad Area
Source Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
15.7 x 15.7 MILS
3.9 MILS
3.9 x 3.9 MILS
9.1 x 8.1 MILS
Al-Si - 35,000Å
Au - 12,000Å
GROSS DIE PER 6 INCH WAFER
95,400
PRINCIPAL DEVICE TYPES
CEDM7004
w w w. c e n t r a l s e m i . c o m
R1 (22-March 2010)