CP392V_10 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Smal Signal Transistor NPN - Amp/Switch Transistor Chip

PROCESS CP392V
Smal Signal Transistor
NPN - Amp/Switch Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
EPITAXIAL PLANAR
11 x 11 MILS
7.1 MILS
3.7 x 3.7 MILS
3.7 x 3.7 MILS
Al - 30,000Å
Au - 12,000Å
GEOMETRY
GROSS DIE PER 4 INCH WAFER
93,826
PRINCIPAL DEVICE TYPES
2N3904
CMKT3904
CMLT3904E
CMPT3904
CMPT3904E
CMST3904
CXT3904
CZT3904
R0
BACKSIDE COLLECTOR
w w w. c e n t r a l s e m i . c o m
R2 (13-May 2010)