CP392 Datasheet, PDF (1/1 Pages) Central Semiconductor Corp – Small Signal Transistor NPN - Amp/Switch Transistor Chip

PROCESS CP392
Small Signal Transistor
NPN - Amp/Switch Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
EPITAXIAL PLANAR
11 x 11 MILS
7.0 MILS
3.7 x 3.7 MILS
3.7 x 3.7 MILS
Al - 30,000Å
Au - 18,000Å
GEOMETRY
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
GROSS DIE PER 4 INCH WAFER
93,826
PRINCIPAL DEVICE TYPES
2N3904
CMKT3904
CMLT3904E
CMPT3904
CMPT3904E
CMST3904
CXT3904
CZT3904
R0
R0 (06 -April 2004)