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CP375 Datasheet, PDF (1/3 Pages) Central Semiconductor Corp – N-Channel MOSFET Die Enhancement-Mode | |||
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w w w. c e n t r a l s e m i . c o m
CP375
N-Channel MOSFET Die
Enhancement-Mode
The CP375 medium power N-Channel MOSFET is designed for power management and load
switching applications. The 7.5 mil thick die provides an ultra low proï¬le device that is readily
attached using standard die attach wire bond processes.
APPLICATIONS:
⢠Load switching
⢠Power management
⢠DC-DC conversion
FEATURES:
⢠Low on-resistance, rDS(ON)
⢠Low gate charge, Qgs
⢠High drain current density
MECHANICAL SPECIFICATIONS:
Die Size
62 x 38 MILS
Die Thickness
7.5 MILS
Gate Bonding Pad Area
13.7 x 18.8 MILS
Source Bonding Pad Area 30 x 55 MILS
Top Side Metalization
Al - 40,000Ã
Back Side Metalization
Ti/Ni/Ag - 1,000Ã
/3,000Ã
/10,000Ã
Scribe Alley Width
3.15 MILS
Wafer Diameter
8 INCHES
Gross Die Per Wafer
18,700
MAXIMUM RATINGS: (TA=25°C)
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Steady State)
Maximum Pulsed Drain Current, tp=10μs
Operating and Storage Junction Temperature
SYMBOL
VDS
VGS
ID
IDM
TJ, Tstg
30
20
11
50
-55 to +150
UNITS
V
V
A
A
°C
ELECTRICAL CHARACTERISTICS: (TA=25°C unless otherwise noted)
SYMBOL
TEST CONDITIONS
MIN
TYP
IGSSF, IGSSR VGS=20V, VDS=0
IDSS
VDS=30V, VGS=0
BVDSS
VGS=0, ID=250μA
30
VGS(th)
VGS=VDS, ID=250μA
1.0
1.8
VSD
VGS=0, IS=2.6A
rDS(ON)
VGS=10V, ID=11A
14
rDS(ON)
VGS=4.5V, ID=9.0A
18
Crss
VDS=15V, VGS=0, f=1.0MHz
100
Ciss
VDS=15V, VGS=0, f=1.0MHz
860
Coss
VDS=15V, VGS=0, f=1.0MHz
120
MAX
100
1.0
UNITS
nA
μA
V
3.0
V
1.2
V
20
mΩ
30
mΩ
pF
pF
pF
R0 (13-August 2013)
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