CP314_08 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor NPN - High Current Transistor Chip

Central^TM
Semiconductor Corp.
PROCESS CP314
Small Signal Transistor
NPN - High Current Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
40 x 40 MILS
9.0 MILS
7.9 x 8.7 MILS
9.0 x 14 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 4 INCH WAFER
6,936
PRINCIPAL DEVICE TYPES
CBCP68
CBCX68
CZT651
MPS650
MPS651
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R3 (8-October 2008)