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CP304 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor NPN - High Current Transistor Chip | |||
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PROCESS CP304
Small Signal Transistor
NPN - High Current Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
22 x 22 MILS
9.0 MILS
5.7 x 3.9 MILS
5.3 x 3.9 MILS
Al - 30,000Ã
Au - 18,000Ã
GROSS DIE PER 4 INCH WAFER
22,400
PRINCIPAL DEVICE TYPES
MPSA05
MPSA06
w w w. c e n t r a l s e m i . c o m
R4 (22-March 2010)
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