CP237 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor NPN - Saturated Switch Transistor Chip

PROCESS CP237
Small Signal Transistor
NPN - Saturated Switch Transistor Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
30 x 30 MILS
9.0 MILS
4.4 x 12.5 MILS
4.4 x 12.5 MILS
Al - 30,000Å
Au - 12,000Å
GROSS DIE PER 4 INCH WAFER
12,550
PRINCIPAL DEVICE TYPES
2N3725
2N3725A
MPQ3725
MPQ3725A
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R2 (1-August 2002)