CP225 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor NPN - Amp/Switch Transistor Chip

PROCESS CP225
Small Signal Transistor
NPN - Amp/Switch Transistor Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
19.8 x 19.8 MILS
9.5 MILS
4.3 x 4.3 MILS
4.3 x 4.3 MILS
Al - 30,000Å
Au - 12,000Å
GROSS DIE PER 4 INCH WAFER
28,960
PRINCIPAL DEVICE TYPES
2N2218A
2N2221A
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R1 (1-August 2002)