CP214 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor NPN - Silicon RF Transistor Chip

PROCESS CP214
Small Signal Transistor
NPN - Silicon RF Transistor Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
B
E
EPITAXIAL PLANAR
16 x 16 MILS
7.5 MILS
2.9 x 3.4 MILS
2.9 x 3.4 MILS
Al - 20,000Å
Au - 16,000Å
GROSS DIE PER 4 INCH WAFER
44,460
PRINCIPAL DEVICE TYPES
2N5109
R1
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R2 (1-August 2002)