CP207_10 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor NPN - Saturated Switch Transistor Chip

PROCESS CP207
Small Signal Transistor
NPN - Saturated Switch Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
9.0 x 14 MILS
8.0 MILS
2.7 x 2.7 MILS
2.7 x 2.7 MILS
Al - 13,000Å
Au - 6,000Å
GROSS DIE PER 4 INCH WAFER
93,430
PRINCIPAL DEVICE TYPES
2N2369A
CMPT2369
BACKSIDE COLLECTOR
w w w. c e n t r a l s e m i . c o m
R4 (22-March 2010)