CP206 Datasheet, PDF (1/3 Pages) Central Semiconductor Corp – Small Signal Transistors N - Channel Switch/Chopper J FET Chip

PROCESS CP206
Small Signal Transistors
N - Channel Switch/Chopper J FET Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Drain Bonding Pad Area
Source Bonding Pad Area
Gate Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
BACKSIDE GATE
EPITAXIAL PLANAR
21 x 18 MILS
8.0 MILS
3.8 X 3.8 MILS
3.8 X 3.8 MILS
3.8 X 3.8 MILS
Al - 30,000Å
Au - 6,000Å
GROSS DIE PER 4 INCH WAFER
30,950
PRINCIPAL DEVICE TYPES
2N4391
2N4392
2N4393
CMPF4391
CMPF4392
CMPF4393
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R3 (9 -September 2003)