CP192V Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistors NPN - Amp Switch Transistor Chip

PROCESS CP192V
Small Signal Transistors
NPN - Amp Switch Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
BACKSIDE COLLECTOR
EPITAXIAL PLANAR
13 x 17 MILS
7.1 MILS
3.0 X 3.0 MILS
3.0 X 3.0 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 4 INCH WAFER
52,920
PRINCIPAL DEVICE TYPES
2N3904
CMKT3904
CMLT3904E
CMPT3904
CMST3904
CXT3904
CZT3904
145 Adams Avenue
Hauppauge, NY 11788 USA
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Fax: [phone]
www.centralsemi.com
R0 (13-February 2006)