CP192 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor NPN - Amp/Switch Transistor Chip

PROCESS CP192
Small Signal Transistor
NPN - Amp/Switch Transistor Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
BACKSIDE COLLECTOR
EPITAXIAL PLANAR
13 x 17 MILS
9.0 MILS
3.0 X 3.0 MILS
3.0 X 3.0 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 4 INCH WAFER
52,240
PRINCIPAL DEVICE TYPES
2N3904
CMPT3904
CMST3904
CXT3904
CZT3904
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R2 (1 -August 2002)