CP191V Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor NPN - Amp/Switch Transistor Chip

PROCESS CP191V
Small Signal Transistor
NPN - Amp/Switch Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
16.5 x 16.5 MILS
7.1 MILS
3.5 x 4.3 MILS
3.5 x 4.3 MILS
Al - 30,000Å
Au-As - 13,000Å
GROSS DIE PER 4 INCH WAFER
41,699
PRINCIPAL DEVICE TYPES
CMLT2222A
CMLT2207
CMLM2205
CMKT2207
w w w. c e n t r a l s e m i . c o m
R1 (22-March 2010)