CP191 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor NPN - Amp/Switch Transistor Chip

PROCESS CP191
Small Signal Transistor
NPN - Amp/Switch Transistor Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
EPITAXIAL PLANAR
16.5 x 16.5 MILS
9.0 MILS
3.5 x 4.3 MILS
3.5 x 4.3 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 4 INCH WAFER
41,690
PRINCIPAL DEVICE TYPES
2N2219A
2N2222A
CMPT2222A
CMST2222A
CXT2222A
CZT2222A
MD2219A
PN2222A
R2 (1 -August 2002)