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CP188 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor NPN - Low Noise Amplifier Transistor Chip
PROCESS CP188
Small Signal Transistor
NPN - Low Noise Amplifier Transistor Chip
CentralTM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
15 x 15 MILS
9.0 MILS
4.0 x 4.0 MILS
5.5 x 5.5 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 4 INCH WAFER
53,730
PRINCIPAL DEVICE TYPES
CMPT2484
CMPT5088
CMPT5089
CMPT6428
CMPT6429
2N2484
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: (631) 435-1110
Fax: (631) 435-1824
www.centralsemi.com
R2 (1 -August 2002)