CP176 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Power Transistor NPN - Amp/Switch Transistor Chip

PROCESS CP176
Power Transistor
NPN - Amp/Switch Transistor Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
MULTI EPITAXIAL PLANAR
203 x 227 MILS
12.5 ± 1.0 MILS
38 x 76 MILS
47 x 72 MILS
Al - 50,000Å
Ag - 10,000Å
GROSS DIE PER 4 INCH WAFER
240
PRINCIPAL DEVICE TYPES
MJ15003
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R2 (1 -August 2002)