CMLDM8002A_10 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – SURFACE MOUNT DUAL P-CHANNEL ENHANCEMENT-MODE SILICON MOSFET

CMLDM8002A
CMLDM8002AG*
CMLDM8002AJ
SURFACE MOUNT
DUAL P-CHANNEL
ENHANCEMENT-MODE
SILICON MOSFET
SOT-563 CASE
* Device is Halogen Free by design
APPLICATIONS:
• Load/Power Switches
• Power Supply Converter Circuits
• Battery Powered Portable Equipment
w w w. c e n t r a l s e m i . c o m
DESCRIPTION:
These CENTRAL SEMICONDUCTOR devices are
dual chip Enhancement-mode P-Channel Field Effect
Transistors, manufactured by the P-Channel DMOS
Process, designed for high speed pulsed amplifier and
driver applications. The CMLDM8002A utilizes the USA
pinout configuration, while the CMLDM8002AJ, utilizing
the Japanese pinout configuration, is available as a
special order. These special Dual Transistor devices
offer Low rDS(on) and Low VDS(on).
MARKING CODES: CMLDM8002A: C08
CMLDM8002AG*: CG8
CMLDM8002AJ: CJ8
FEATURES:
• Dual Chip Device
• Low rDS(on)
• Low VDS(on)
• Low Threshold Voltage
• Fast Switching
• Logic Level Compatible
• Small SOT-563 package
MAXIMUM RATINGS: (TA=25°C)
Drain-Source Voltage
Drain-Gate Voltage
Gate-Source Voltage
Continuous Drain Current
Continuous Source Current (Body Diode)
Maximum Pulsed Drain Current
Maximum Pulsed Source Current
Power Dissipation (Note 1)
Power Dissipation (Note 2)
Power Dissipation (Note 3)
Operating and Storage Junction Temperature
Thermal Resistance
SYMBOL
VDS
VDG
VGS
ID
IS
IDM
ISM
PD
PD
PD
TJ, Tstg
Θ_JA
50
50
20
280
280
1.5
1.5
350
300
150
-65 to +150
357
UNITS
V
V
V
mA
mA
A
A
mW
mW
mW
°C
°C/W
ELECTRICAL CHARACTERISTICS PER TRANSISTOR: (TA=25°C unless otherwise noted)
SYMBOL
TEST CONDITIONS
MIN
MAX
IGSSF, IGSSR VGS=20V, VDS=0
100
IDSS
VDS=50V, VGS=0
1.0
IDSS
VDS=50V, VGS=0, TJ=125°C
500
ID(ON)
VGS=10V, VDS=10V
500
BVDSS
VGS=0, ID=10μA
50
VGS(th)
VDS=VGS, ID=250μA
1.0
2.5
UNITS
nA
μA
μA
mA
V
V
Notes: (1) Ceramic or aluminum core PC Board with copper mounting pad area of 4.0mm²
(2) FR-4 Epoxy PC Board with copper mounting pad area of 4.0mm²
(3) FR-4 Epoxy PC Board with copper mounting pad area of 1.4mm²
R3 (18-January 2010)