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MC7884 Datasheet, PDF (2/2 Pages) California Eastern Labs – NECs 870 MHz GaAs CATV POWER DOUBLER AMPLIFIER
MC 7881, 7882, 7883, 7884
ELECTRICAL CHARACTERISTICS, cont. (TA = 30±5 °C, VDD = 24 V, ZS = ZL = 75 Ω)
PART NUMBER
MC-7881
MC-7882
MC-7883
MC-7884
SYMBOLS CHARACTERISTICS
UNITS MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX
IDD Operating Current
mA 310 – 360 310 – 360 310 – 360 310 – 360
CTB
XMod
Composite Triple Beat
Cross Modulation1
dBc – – -60 – – -60 – – -60 – – -60
dBc – – -55 – – -55 – – -55 – – -55
CSO Composite Second Order dBc – – -63 – – -63 – – -63 – – -63
Note:
1. Measured per US standard methods and procedures (using selective level meter).
TEST CONDITIONS
RF OFF
110 Channels,
VOUT = 52 dBmV at
745.25 MHz, 10 dB tilted
across the band
ABSOLUTE
MAXIMUM RATINGS1 (TCASE= 25 °C)
SYMBOLS
VDD
VI
TC
TSTG
PARAMETERS
UNITS RATINGS
Supply Voltage
V
30
Input Voltage (Single Tone)2 dBmV
65
Operating Case Temperature °C -30 to +100
Storage Temperature
°C -40 to +100
Note:
1. Operation in excess of any one of these parameters may result
in permanent damage.
2. Maximum single channel power applied to the input for 1 minute
with no measurable degradation in performance.
RECOMMENDED
OPERATING CONDITIONS (Zs = ZL = 75Ω)
SYMBOLS
PARAMETERS
UNITS MIN TYP MAX
VDD Supply Voltage
V 23.5 24.0 24.5
Vi
Input Voltage1, MC-7881 dBmV – 36.0 39.0
MC-7882
– 34.0 37.0
MC-7883
– 32.0 35.0
MC-7884
– 29.0 32.0
TC
Operating Case
Temperature
°C -30 +25 +85
Note:
1. Test Conditions: 110 Channels, 10 dB tilted across the band.
ORDERING INFORMATION
PART NUMBER
PACKAGE
QUANTITY
MC-7881
7-pin special with heatsink 50pcs max/ Tray
MC-7882
7-pin special with heatsink 50pcs max/ Tray
MC-7883
7-pin special with heatsink 50pcs max/ Tray
MC-7884
7-pin special with heatsink 50pcs max/ Tray
NOTES ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
1. The space between PC board and root of the lead should be
kept more than 1 mm to prevent undesired stress on the lead and
also should be kept less than 4 mm to prevent undesired parasitic
inductance.
Recommended space is 2.0 to 3.0 mm typical.
2. Recommended torque strength of the screw is 59 to 78 Ncm.
3. Form the ground pattern as wide as possible to minimize ground
impedance. (to prevent undesired oscillation)
All the ground pins must be connected together with wide ground
pattern to decrease impedance difference.
This product should be soldered in the following recommended
conditions. Other soldering methods and conditions than the
recommended conditions are to be consulted with our sales
representatives.
Soldering
Method
Soldering
Conditions
Condition
Symbol
Pin Part Heating Pin area temperature: less
–
than 260°C1
Hour: Within 2 sec./pin
Note.
1. The point of pin part heating must be kept at a distance of more
than 1.2 mm from the root of lead.
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
03/16/2003
A Business Partner of NEC
Compound Semiconductor Devices, Ltd.