PS9506 Datasheet, PDF (17/21 Pages) Renesas Technology Corp – 0.6 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 8-PIN DIP PHOTOCOUPLER

Preliminary document
PS9506,PS9506L1,PS9506L2,PS9506L3
A Business Partner of Renesas Electronics Corporation.
Chapter Title
<R> NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of peak reflow temperature
• Time of temperature higher than 220°C
• Time to preheat temperature from 120 to 180°C
• Number of reflows
• Flux
260°C or below (package surface temperature)
10 seconds or less
60 seconds or less
120±30 s
T hree
Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt% is
recommended.)
Recommended Temperature Profile of Infrared Reflow
180°C
120°C
120±30 s
(preheating)
(heating)
to 10 s
to 60 s
260°C MAX.
220°C
Time (s)
(2) Wave soldering
• Temperature
• Time
• Preheating conditions
• Number of times
• Flux
260°C or below (molten solder temperature)
10 seconds or less
120°C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output
transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
R08DS0018EJ0100 Rev.1.00
Nov 10, 2011
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