UPG2214TK Datasheet, PDF (11/12 Pages) List of Unclassifed Manufacturers – NEC1/2W LOW VOLTAGE L, S-BAND SPDT SWITCH

PG2214TK
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Soldering Conditions
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220C or higher
Preheating time at 120 to 180C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (package surface temperature)
Time at temperature of 200C or higher
Preheating time at 120 to 150C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature)
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 260C or below
: 10 seconds or less
: 60 seconds or less
: 12030 seconds
: 3 times
: 0.2%(Wt.) or below
: 215C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
: 260C or below
: 10 seconds or less
: 120C or below
: 1 time
: 0.2%(Wt.) or below
: 350C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Condition Symbol
IR260
VP215
W S260
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10475EJ04V0DS
11