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PS7431-1A Datasheet, PDF (10/11 Pages) NEC – NECs 4 PIN SOP PACKAGE, HIGH ISOLATION VOLTAGE, 3000 V.r.m.s. 1 FORM A TYPE SOLID STATE RELAY | |||
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PS7431-1A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
⢠Peak reflow temperature
260°C or below (package surface temperature)
⢠Time of peak reflow temperature
10 seconds or less
⢠Time of temperature higher than 220°C
60 seconds or less
⢠Time to preheat temperature from 120 to 180°C 120±30 s
⢠Number of reflows
Three
⢠Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
180ËC
120ËC
120±30 s
(preheating)
(heating)
to 10 s
to 60 s
260ËC MAX.
220ËC
Time (s)
(2) Wave soldering
⢠Temperature
⢠Time
⢠Preheating conditions
⢠Number of times
⢠Flux
260°C or below (molten solder temperature)
10 seconds or less
120°C or below (package surface temperature)
One
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Cautions
⢠Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
10
Data Sheet PN10458EJ01V0DS
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