UPC2747TB_V1 Datasheet, PDF (1/17 Pages) California Eastern Labs – 3 V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUNICATIONS

BIPOLAR ANALOG INTEGRATED CIRCUITS
PC2747TB,PC2748TB
3 V, SUPER MINIMOLD SILICON MMIC
AMPLIFIER FOR MOBILE COMMUNICATIONS
DESCRIPTION
The PC2747TB, PC2748TB are silicon monolithic integrated circuits designed as amplifier for mobile
communications. These ICs are packaged in super minimold package which is smaller than conventional minimold.
These ICs are manufactured using our 20 GHz fT NESAT lll silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, these ICs have excellent performance, uniformity and reliability.
FEATURES
• Supply voltage
: VCC = 2.7 to 3.3 V
• Noise figure
: PC2747TB ; NF = 3.3 dB TYP. @ f = 900 MHz
PC2748TB ; NF = 2.8 dB TYP. @ f = 900 MHz
• Power gain
: PC2747TB ; GP = 12 dB TYP. @ f = 900 MHz
PC2748TB ; GP = 19 dB TYP. @ f = 900 MHz
• Operating frequency
: PC2747TB ; DC to 1.8 GHz
PC2748TB ; 0.2 to 1.5 GHz
• Isolation
: PC2747TB ; ISL = 40 dB TYP. @ f = 900 MHz
PC2748TB ; ISL = 40 dB TYP. @ f = 900 MHz
• High-density surface mounting : 6-pin super minimold package (2.0  1.25  0.9 mm)
APPLICATION
• Buffer amplifiers for mobile telephones, etc. (PDC800M, GSM)
ORDERING INFORMATION
Part Number
PC2747TB-E3
Package
6-pin super minimold
PC2748TB-E3
Marking
C1S
C1T
Supplying Form
 Embossed tape 8 mm wide
 1, 2, 3 pins face the perforation side of the tape
 Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: PC2747TB-A, PC2748TB-A
Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
Document No. PU10201EJ01V0DS (1st edition)
(Previous No. P13444EJ3V0DS00)
Date Published December 2002 CP(K)
The mark  shows major revised points.