CAT3636_07 Datasheet, PDF (7/16 Pages) Catalyst Semiconductor – 6-Channel Quad-ModeTM Fractional LED Driver in TQFN3x3

PIN DESCRIPTION
Pin # Name
Function
1 LEDC2 LEDC2 cathode terminal
2 LEDC1 LEDC1 cathode terminal
3 LEDB2 LEDB2 cathode terminal
4 LEDB1 LEDB1 cathode terminal
5 LEDA2 LEDA2 cathode terminal
6 LEDA1 LEDA1 cathode terminal
7 VOUT
Charge pump output, connect to LED anodes
8 VIN
Charge pump input, connect to battery or supply
9 C1+
Bucket capacitor 1, positive terminal
10 C1-
Bucket capacitor 1, negative terminal
11 C2+
Bucket capacitor 2, positive terminal
12 C2-
Bucket capacitor 2, negative terminal
13/14 NC
No connect
15 GND
Ground reference
16 EN/SET
TAB TAB
Device enable (active high) and 1 wire control
iConnect _{to GND on the PCB}
CAT3636
PIN FUNCTION
VIN is the supply pin for the charge pump. A small
1μF ceramic bypass capacitor is required between the
VIN pin and ground near the device. The operating
input voltage range is from 2.5V to 5.5V. Whenever
the input supply falls below the under-voltage
threshold (2V) all the LED channels will be
automatically disabled and the device register are
reset to default values.
EN/SET is the enable and one wire addressable
control logic input for all LED channels. Guaranteed
levels of logic high and logic low are set at 1.3V and
0.4V respectively. When EN/SET is initially taken
high, the device becomes enabled and all LED
currents remain at 0mA. To place the device into zero
current mode, the EN/SET pin must be held low for
more than 1.5ms.
VOUT is the charge pump output that is connected to
the LED anodes. A small 1μF ceramic bypass
capacitor is required between the VOUT pin and
ground near the device.
GND is the ground reference for the charge pump.
The pin must be connected to the ground plane on the
PCB.
C1+, C1- are connected to each side of the ceramic
bucket capacitor C1.
C2+, C2- are connected to each side of the ceramic
bucket capacitor C2.
LEDxx provide the internal regulated current for
each of the LED cathodes. These pins enter high-
impedance zero current state whenever the device
is placed in shutdown mode.
TAB is the exposed pad underneath the package.
For best thermal performance, the tab should be
soldered to the PCB and connected to the ground
plane.
© 2007 Catalyst Semiconductor, Inc.
7
Characteristics subject to change without notice
Doc. No. 5020 Rev. C