CAT6221 Datasheet, PDF (2/11 Pages) Catalyst Semiconductor – 300mA CMOS Dual LDO Regulator

CAT6221
PIN DESCRIPTIONS
Pin # Name Function
1 EN1 Enable input (active high) for VOUT1.
2 VIN Supply voltage input.
3 EN2 Enable input (active high) for VOUT2.
4 VOUT2 LDO Output Voltage 2.
5 GND Ground reference.
6 VOUT1 LDO Output Voltage 1.
BLOCK DIAGRAM
VIN
V_IN
EN1
Reference
LDO1
EN1
Shutdown
Switch
VOUT1
V_OUT1
PIN FUNCTION
VIN is the supply pin for the LDO. A small 1μF
ceramic bypass capacitor is required between the V_IN
pin and ground near the device. When using longer
connections to the power supply, C_IN value can be
increased without limit. The operating input voltage
range is from 2.3V to 5.5V.
EN1 & 2 are the enable control logic (active high) for the
regulator outputs.
VOUT1 & 2 are the LDO regulator outputs. A small 1μF
ceramic bypass capacitor is required between the
VOUT pins and ground. For better transient response,
its value can be increased to 4.7μF.
The capacitor should be located near the device. For
the TSOT23 6-lead package, a continuous 300mA
output current for both LDOs may turn-on the thermal
protection.
EN2
LDO2
EN2
Shutdown
Switch
GND
VOUT2
V_OUT2
Figure 2. CAT6221 Functional Block Diagram
On each output, a 250Ω internal shutdown switch
discharges the output capacitor in the no-load
condition.
GND is the ground reference for the LDO. The pin
must be connected to the ground plane on the PCB.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Parameter
V_IN
V_EN, V_OUT
Junction Temperature, T_J
Power Dissipation, P_D
Storage Temperature Range, T_S
Lead Temperature (soldering, 5 sec.)
ESD Rating (Human Body Model)
Rating
Unit
0 to 6.5
V
-0.3 to V_IN+0.3
V
+150
°C
Internally Limited ⁽²⁾
mW
-65 to +150
°C
260
°C
3
kV
RECOMMENDED OPERATING CONDITIONS ⁽³⁾
Parameter
Range
V_IN
2.3 to 5.5
V_EN
0 to V_IN
Junction Temperature Range, T_J
-40 to +125
Package Thermal Resistance (TSOT23), θ_JA
235
Typical application circuit with external components are shown on page 1.
Unit
V
V
°C
°C/W
Notes:
(1) Exceeding maximum rating may damage the device.
(2) The maximum allowable power dissipation at any T_A (ambient temperature) is P_Dmax = (T_Jmax – T_A) / θ_JA. Exceeding the maximum
allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown.
(3) The device is not guaranteed to work outside its operating rating.
Doc. No. MD-10001 Rev. A
2
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice