CM1470 Datasheet, PDF (8/11 Pages) California Micro Devices Corp – Praetorian™ 4-, 6- and 8-Channel Series Inductor Networks

PRELIMINARY
CM1470
Mechanical Details
CM1470-04CP Mechanical Specifications
Dimensions for the CM1470-04CP supplied in a 10-
bump, 0.4mm pitch chip scale package (CSP) are pre-
sented below.
For complete information on the CSP-10, see the Cali-
fornia Micro Devices CSP Package Information docu-
ment.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
10
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 0.791 0.836 0.881 0.0311 0.0329 0.0347
A2 1.985 2.030 2.075 0.0781 0.0799 0.0817
B1 0.395 0.400 0.405 0.0156 0.0157 0.0159
B2 0.395 0.400 0.405 0.0156 0.0157 0.0159
C1 0.168 0.218 0.268 0.0066 0.0086 0.0106
C2 0.165 0.215 0.265 0.0065 0.0085 0.0104
D1 0.537 0.607 0.676 0.0211 0.0239 0.0266
D2 0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
OptiGuard^TM Coated CSP
BOTTOM VIEW
A1
C1
B1
OptiGuard^TM
Coating
5
4
3
2 BA
1
BA
D1
0.25 DIA.
D2
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
NOTE: DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1470-04CP Chip Scale Package
© 2006 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.cmd.com 03/15/06