CM1451 Datasheet, PDF (8/8 Pages) California Micro Devices Corp – LCD & Camera EMI Filter Array with ESD Protection

PRELIMINARY
CM1451
Mechanical Details
CM1450-06CS/CP CSP Mechanical Specifications
CM1451-06CS/CP devices are packaged in a custom
Chip Scale Package (CSP). Dimensions are presented
below. For complete information on CSP packaging,
see the California Micro Devices CSP Package Infor-
mation document.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
15
Dim
Millimeters
Inches
Min Nom Max Min Nom Max
A1 2.915 2.960 3.005 0.1148 0.1165 0.1183
A2 1.285 1.330 1.375 0.0506 0.0524 0.0541
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.180 0.230 0.280 0.0071 0.0091 0.0110
C2 0.180 0.230 0.280 0.0071 0.0091 0.0110
D1 0.600 0.670 0.739 0.0236 0.0264 0.0291
D2 0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B2
B1
C
B
A
123456
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
OptiGuard^TM
Coating
D1
D2
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1451CS/CP Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER
CM1451-06
CHIP SIZE (mm)
2.96 X 1.33 X 0.6
POCKET SIZE (mm)
B₀ X A₀ X K₀
3.10 X 1.45 X 0.74
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY PER
REEL
3500
P₀
4mm
P₁
4mm
Top
Cover
Tape
P_o
A_o
B_o
K_o
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
P₁
User Direction of Feed
10 Pitches Cumulative
±^{To0l.e2ramnmce On Tape}
W
Center Lines
of Cavity
Figure 9. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
8 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.calmicro.com 01/29/05