CM1441 Datasheet, PDF (7/8 Pages) California Micro Devices Corp – 4-Channel EMI Filter Array w/ ESD + 4-channel ESD Array

CM1441
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste
VALUE
0.240mm
Round
Non-Solder Mask defined pads
0.290mm Round
0.125mm - 0.150mm
0.300mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
+50μm
+20μm
60 seconds
240°C
260°C
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 6. Recommended Non-Solder Mask Defined Pad Illustration
250
200
150
100
Figure 7. Eutectic (SnPb) Solder
Ball Reflow Profile
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 8. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
11/08/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.cmd.com 7