CM1424 Datasheet, PDF (7/8 Pages) California Micro Devices Corp – MultiMedia Card EMI Filter Array with ESD Protection

CM1424
Mechanical Details (cont’d)
CM1424 devices are supplied in custom Chip Scale
Packages (CSP) and are available with optional Opti-
Guard™ coating.
CM1424 Mechanical Specifications
The package dimensions for the CM1424 are pre-
sented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
10
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 1.953 1.998 2.043 0.0769 0.0787 0.0804
A2 1.413 1.458 1.503 0.0556 0.0574 0.0592
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.199 0.249 0.299 0.0078 0.0098 0.0118
C2 0.244 0.294 0.344 0.0096 0.0116 0.0135
D1¹ 0.562 0.606 0.650 0.0221 0.0239 0.0256
D2¹ 0.356 0.381 0.406 0.0140 0.0150 0.0160
D3² 0.575 0.644 0.714 0.0226 0.0254 0.0281
D4² 0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Note 1: Applies to uncoated devices only.
Note 2: Applies to OptiGuard™ (coated) devices only.
Mechanical Package Diagrams
Non-coated CSP
B2
B1
C
B
A
BOTTOM VIEW
A1
C1
SIDE
VIEW
1234
D1
0.30 DIA.
D2
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
OptiGuard™ Coated CSP
BOTTOM VIEW
A1
C1
B2
B1
OptiGuard^TM
Coating
C
B
A
1234
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
D3
D4
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1424 Chip Scale Package
© 2005 California Micro Devices Corp. All rights reserved.
09/16/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: [phone] ▲ Fax: [phone] ▲ www.cmd.com
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