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CM1415 Datasheet, PDF (7/7 Pages) California Micro Devices Corp – 3 Channel Headset EMI Filter with ESD Protection
CM1415
Mechanical Details
CSP Mechanical Specifications
CM1415 devices are packaged in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on CSP packaging, see the Cali-
fornia Micro Devices CSP Package Information docu-
ment.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
8
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 1.405 1.450 1.495 0.0553 0.0571 0.0589
A2 1.365 1.410 1.455 0.0537 0.0555 0.0573
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.175 0.225 0.275 0.0069 0.0089 0.0108
C2 0.220 0.270 0.320 0.0087 0.0106 0.0126
D1 0.600 0.670 0.739 0.0236 0.0264 0.0291
D2 0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
OptiGuardTM
Coating
C
B
A
12345
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
D1
D2
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1415
Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER
CM1415
CHIP SIZE (mm)
1.45 X 1.41 X 0.6
POCKET SIZE (mm)
B0 X A0 X K0
1.55 X 1.52 X 0.71
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY PER
REEL
3500
P0
4mm
P1
4mm
Top
Cover
Tape
Ko
Po
Ao
Bo
10 Pitches cumulative
tolerance on tape
±0.2 mm
W
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P1
User direction of feed
Center lines
of cavity
Figure 7. Tape and Reel Mechanical Data
© 2004 California Micro Devices Corp. All rights reserved.
05/13/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
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