CM1450 Datasheet, PDF (6/8 Pages) California Micro Devices Corp – LCD & Camera EMI Filter Array with ESD Protection

Mechanical Details
CM1450 devices are supplied in custom Chip Scale
Packages (CSP). Dimensions for each of these
devices are presented in the following pages.
CM1450-06CS/CP Mechanical Specifications
The package dimensions for the CM1450-06CS/CP
are presented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
15
Millimeters
Inches
Dim
Min Nom Max Min
Nom Max
A1 2.915 2.960 3.005 0.1148 0.1165 0.1183
A2 1.285 1.330 1.375 0.0506 0.0524 0.0541
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.180 0.230 0.280 0.0071 0.0091 0.0110
C2 0.180 0.230 0.280 0.0071 0.0091 0.0110
D1 0.561 0.605 0.649 0.0221 0.0238 0.0255
D2 0.355 0.380 0.405 0.0140 0.0150 0.0159
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
PRELIMINARY
CM1450
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B2
B1
C
B
A
123456
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
D1
D2
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1450-06CS/CP Chip Scale Package
© 2005 California Micro Devices Corp. All rights reserved.
6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.calmicro.com 01/27/05