CM1204 Datasheet, PDF (6/6 Pages) California Micro Devices Corp – 4-Channel ESD Array in CSP

CM1204
Mechanical Details
CSP Mechanical Specifications
CM1204 devices are packaged in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on CSP packaging, see the Cali-
fornia Micro Devices CSP Package Information docu-
ment.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
5
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 0.915 0.960 1.005 0.0360 0.0378 0.0396
A2 1.285 1.330 1.375 0.0506 0.0524 0.0541
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.180 0.230 0.280 0.0071 0.0091 0.0110
C2 0.180 0.230 0.280 0.0071 0.0091 0.0110
D1 0.600 0.670 0.739 0.0236 0.0264 0.0291
D2 0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
OptiGuard™ Coated CSP
BOTTOM VIEW
A1
C1
B2
B1
OptiGuard^TM
Coating
C
B
A
123
0.30 DIA.
D1
63/37 Sn/Pb (Eutectic) or
D2
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
SIDE
VIEW
Package Dimensions for
CM1204 Chip Scale Packages
CSP Tape and Reel Specifications
PART NUMBER
CM1204
CHIP SIZE (mm)
1.33 X 0.96 X 0.670
POCKET SIZE (mm)
B₀ X A₀ X K₀
1.42 X 1.07 X 0.740
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY PER
REEL
3500
P₀
4mm
P₁
4mm
Top
Cover
Tape
K_o
P_o
A_o
B_o
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
W
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P₁
User Direction of Feed
Center Lines
of Cavity
Figure 5. Tape and Reel Mechanical Data
© 2004 California Micro Devices Corp. All rights reserved.
6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: [phone]
▲ Fax: [phone] ▲ www.calmicro.com
05/10/04