CM1300 Datasheet, PDF (5/5 Pages) California Micro Devices Corp – 4 Channel EMI Filter Network

CM1300
Mechanical Details
CSP Mechanical Specifications
The CM1300 is offered in a custom Chip Scale Pack-
age (CSP). Dimensions are presented below. For com-
plete information on CMD’s Chip Scale Packaging, see
the California Micro Devices CSP Package Information
document.
.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
9
Millimeters
Dim
Min Nom Max
Inches
Min Nom Max
A1 0.940 0.985 1.030 0.0370 0.0388 0.0406
A2 2.440 2.485 2.530 0.0961 0.0978 0.0996
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.495 0.500 0.505 0.0195 0.0197 0.0199
C1 0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
C2 0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
D1 0.575 0.644 0.714 0.0226 0.0254 0.0281
D2 0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape
and reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
OptiGuard^TM
Coating
5
4
3
2 BA
1
BA
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
D1
D2
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1300 9-bump Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER
CM1300
PKG. SIZE (mm)
2.485 X 0.985 X 0.644
POCKET SIZE (mm)
B₀ X A₀ X K₀
2.62 X 1.12 X 0.762
TAPE WIDTH
W
8mm
REEL
DIA.
178mm (7")
Top
Cover
Tape
K_o
P_o
A_o
B_o
10 Pitches Cumulative
±^{To0l.e2ramnmce On Tape}
W
QTY
PER
REEL
3500
P₀
P₁
4mm 4mm
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P₁
User Direction of Feed
Center Lines
of Cavity
Figure 4. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
11/07/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.cmd.com 5