PACDN1404C Datasheet, PDF (3/3 Pages) California Micro Devices Corp – ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE

CALIFORNIA MICRO DEVICES
Package Diagrams
0.252
mm
B
A
0.35mm Dia.
Bumps
1.804mm
0.65
mm
0.65
mm
123
0.252
mm
PACDN1404C
3.104mm
0.65
0.252
mm
mm
0.65
mm
B
A
0.35mm Dia.
Bumps
12345
0.252
mm
PACDN1408C
PACDN1404C
PACDN1408C
PACDN1416C
1.154mm
0.381mm
0.643mm
1.154mm
0.381mm
0.643mm
0.252
mm
3.104mm
0.65
mm
0.65
mm
B
A
0.35mm Dia.
Bumps
1
2
3
4
5
0.252
mm
PACDN1416C
2.454mm
0.381mm
0.643mm
Pin Orientation
Components are symmetrical, and do not require orientation to pin-1 found in conventional semiconductors. The part
may be rotated 180° without affecting operation.
© 2000 California Micro Devices Corp. All rights reserved.
8/4/2000 215 Topaz Street, Milpitas, California 95035
Tel: [phone]
Fax: [phone]
www.calmicro.com
3