CSPRC032 Datasheet, PDF (2/3 Pages) California Micro Devices Corp – CHIP SCALE PACKAGE(CSP) EMI FILTER NETWORK

CALIFORNIA MICRO DEVICES
CSPRC032
0.2425
mm
B
A
0.35mm Dia.
Bumps
2.485mm
0.5mm
0.5
mm
12345
0.2425
mm
Figure 2. CSPRC032 Package Diagram
0.985mm
0.381mm
0.643mm
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Pad Size on PCB
0.300mm
Pad Shape
Round
Pad Definition
Non Solder Mask Devined Pads (NSMD)
Solder Mask Opening
0.350mm
Solder Stencil Thickness
0.152mm
Solder Stencil Aperture Opening
0.360mm (sq.)
Solder Flux Ratio
50/50
No Clean Solder Paste
Bond Trace Finish
OSP (Entek Cu Plus 106A)
CSPRC032 FILTER TYPICAL MEASURED FREQUENCY RESPONSE (S21) MEASUREMENT
The measurement is done with 50Ω-source & 50Ω-load impedance using a HP 8753C Network Analyzer with a
HP85047A S-parameter Test Set.
CH1 ^S21
1og MAG
1
Cor
5 dB/ REF 0 dB
2
H1d
1: –5.8017 dB
1.000 000 MHz
2: –8.8028 dB
82.026 MHz
3: –37.303 dB
1.82 GHz
4: –32.903 dB
3GHZ
4
3
START .300 000 MHz
STOP 3 000.000 000 MHz
CSPRC032 Filter A2-B2 to GND (A3)
©2000 California Micro Devices Corp. All rights reserved.
2
215 Topaz Street, Milpitas, California 95035
Tel: [phone]
Fax: [phone]
www.calmicro.com 9/26/2000