CM3018 Datasheet, PDF (11/11 Pages) California Micro Devices Corp – Micropower, 150mA Low Noise CMOS Regulator with Fast Response

PRELIMINARY
CM3018
Mechanical Details
CSP Mechanical Specifications
CM3018CS/CP devices are packaged in a custom
Chip Scale Package (CSP) with OptiGuard^TM coating.
Dimensions are presented below. For complete infor-
mation on CSP packaging, see the California Micro
Devices CSP Package Information document.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
5
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 0.961 1.006 1.051 0.0378 0.0396 0.0414
A2 1.418 1.463 1.508 0.0558 0.0576 0.0594
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.203 0.253 0.303 0.0080 0.0100 0.0119
C2 0.247 0.297 0.347 0.0097 0.0117 0.0136
D1 0.600 0.670 0.739 0.0236 0.0264 0.0291
D2 0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART
NUMBER
CM3018
CHIP SIZE (mm)
1.463 X 1.006 X 0.670
POCKET SIZE (mm)
B₀ X A₀ X K₀
1.67 X 1.17 X 0.730
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B2
B1
C
B
A
123
0.30 DIA.
63/37 Sn/Pb
SOLDER BUMPS
OptiGuard^TM
Coating
D1
D2
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Custom 5-Bump Chip Scale Package
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY PER
REEL
3500
P₀
4mm
P₁
4mm
Top
Cover
Tape
K_o
P_o
A_o
B_o
10 Pitches Cumulative
±^{To0l.e2ramnmce On Tape}
W
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
P₁
User Direction of Feed
Center Lines
of Cavity
Figure 1. Tape and Reel Mechanical Data
© 2004 California Micro Devices Corp. All rights reserved.
07/29/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: [phone] ▲ Fax: [phone] ▲ www.calmicro.com 11